PART |
Description |
Maker |
IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
TSC607-ZPPACKOF10 TSC506-ZP |
IC FLEX 10KE FPGA 200K 600-BGA 780-pin FineLine BGA BEFESTIGUNGSKLAMMER多珀0ST
|
OSRAM GmbH
|
FGA292-720G FGA272-720G FGAX168-720G 1FGA241-720G |
292 POS 1.27MM BGA SMT ADAPTER BGA292, IC SOCKET 272 POS 1.27MM BGA SMT ADAPTER BGA272, IC SOCKET BGA168, IC SOCKET BGA241, IC SOCKET BGA521, IC SOCKET BGA204, IC SOCKET 352 POS 1.27MM BGA SMT ADAPTER BGA416, IC SOCKET
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
FDZ4670 |
N-Channel PowerTrench?MOSFET BGA 30V, 25A, 2.5mΩ N-Channel PowerTrench㈢MOSFET BGA 30V, 25A, 2.5mヘ
|
Fairchild Semiconductor
|
HYRDU64164M-80M HYRDU72184M-80M HYRDU72184M-60M |
4M X 16 RAMBUS, PBGA66 MICRO, BGA-66 4M X 18 RAMBUS, PBGA74 MICRO, BGA-74
|
Hynix Semiconductor, Inc.
|
2FGA320-638G 2FGAX241-720G |
320 POS 1.27MM BGA ADAPTER 241 POS 1.27MM BGA SMT ADAPTER
|
Advanced Interconnections
|
IBM25PPC740L-GB375A2T IBM25PPC740L-GB375A2R IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|CERAMIC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC 微处理器| 32位|的CMOS | BGA封装| 255PIN |陶瓷
|
Glenair, Inc. Vishay Semiconductors
|
IS61NVP51272-250B1 IS61NVP51272-250B1I IS61NVP1024 |
512K X 72 ZBT SRAM, 2.6 ns, PBGA209 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209 1M X 36 ZBT SRAM, 2.6 ns, PBGA165 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165 1M X 36 ZBT SRAM, 3.1 ns, PBGA165 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165 512K X 72 ZBT SRAM, 3.1 ns, PBGA209 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
|
Integrated Silicon Solution, Inc.
|
US115T US115TE US112 US112T US112E US211 US211E US |
Analog IC Intel® LXT16726 DeMUX, 132-pin BGA, Tray Intel® LXT16726 DeMUX, 142-pin BGA, Tray
|
|
GS8322Z72C-225T GS8322Z72GC-225T GS8322Z18B-225IT |
512K X 72 ZBT SRAM, 7 ns, PBGA209 14 X 22 MM, 1 MM PITCH, BGA-209 512K X 72 ZBT SRAM, 7 ns, PBGA209 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 2M X 18 ZBT SRAM, 7 ns, PBGA119
|
GSI Technology, Inc.
|